1:1 machine dispense adhesive. Adhesive for bonding synthetic aggregates to metal. A medium viscosity, room temperature curing, two component epoxy adhesive. Product was developed with improved thin film set time when bonding metal substrates.
High temperature clear epoxy. An unfilled, heat resistant, clear laminating system. Products low viscosity gives the system excellent wet-out properties to fibreglass and other reinforcing fibres. The material exhibits high physical strengths and modulus with moderate post cure temperatures.
1:1 Mix Ratio, 130°C Operating, General Purpose, Low cost. A two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. Its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets UL94-V0 in house flammability testing.
Room Temperature Cure Epoxy system suitable for potting and casting electrical / electronic components. 2:1 machine dispense friendly mix. Suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing.
2:1 machine dispense friendly mix. A filled, room temperature cure, two component epoxy system. The product is suitable for potting / encapsulating electrical and electronic components. The use of non-abrasive fillers and the convenient mix ratio makes it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing.
Room temperature cure epoxy system suitable for potting and casting electrical / electronic components. 2:1 machine dispense friendly mix. The product is suitable for potting/encapsulating electrical and electronic components. The use of non-abrasive fillers and the convenient mix ratio makes it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing.
