CLR 1190 / CLH 6140

General purpose variable substrate adhesive. A two component room temperature curing epoxy system. Product is suitable for potting, adhesive, and coating applications. Product meets the food and drug administration (FDA) regulations permitting use in food contact applications. CLR 1190 / CLH 6140

CLR 1205 / CLH 6770

Clear low viscosity semi-flexible adhesive / sealant. A low viscosity, two component unfilled, room temperature cure epoxy system. CLR 1205 / CLH 6770

CLR 1556 / CLH 6510

Good thermal cycling, 2:1 mix by volume. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance. CLR 1556 / CLH 6510

CLR 1556 / CLH 6520

Soft 50/40D, Slow gel - Electronic Modules, Machinable. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance. CLR 1556 / CLH 6520

CLR 1583 / CLH 6229

Excellent for potting thermostats and sensors. A two component, room temperature cure, potting and encapsulating epoxy system. Material contains non-abrasive fillers suitable for machine dispense. CLR 1583 / CLH 6229

XRD 1116 / XHD 1117

Room Temperature Cure Epoxy system suitable for potting and casting electrical / electronic components. 2:1 machine dispense friendly mix. Suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. XRD 1116 / XHD 1117

XRD 1116 / XHD 1158

2:1 machine dispense friendly mix. A filled, room temperature cure, two component epoxy system. The product is suitable for potting / encapsulating electrical and electronic components. The use of non-abrasive fillers and the convenient mix ratio makes it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. XRD 1116 / XHD 1158

XRD 1116 / XHD 1281

Room temperature cure epoxy system suitable for potting and casting electrical / electronic components. 2:1 machine dispense friendly mix. The product is suitable for potting/encapsulating electrical and electronic components. The use of non-abrasive fillers and the convenient mix ratio makes it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. XRD 1116 / XHD 1281

XRD 1575 / XH 61418

2:1 machine dispense adhesive. Bonding abrasive wheels and disks. A two component epoxy system suitable for potting, casting and adhesive applications. Product gels quickly and has good thermal cycling endurance. Material is filled with non-abrasive fillers making it suitable for machine dispensing. XRD 1575 / XH6 1418