Soft 50/40D, Slow gel - Electronic Modules, Machinable. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance.
CLR 1556 / CLH 6520
- Cure Type: RT
Soft 50/40D, Slow gel - Electronic Modules, Machinable. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance.
Room Temperature Cure, filled epoxy system suitable for machine dispense. Developed for potting and casting of electrical and electronic components. The cured material exhibits excellent thermal cycling endurance.
Long pot life, Excellent heat dissipation. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required.
Excellent heat dissipation, 125°C Operating. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required.
Excellent for potting thermostats and sensors. A two component, room temperature cure, potting and encapsulating epoxy system. Material contains non-abrasive fillers suitable for machine dispense.
General Purpose Epoxy. An unfilled, room temperature cure, clear laminating system. Its low viscosity gives the system excellent wet -out properties to fibreglass and other reinforcing fibres. The material will also saturate wood readily. For a faster system use hardener CLH 6333.