1:1 Mix Ratio, Fast Gel, Medium viscosity, Flameout, 180°C operating, Ballast potting. A filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio make it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing.
Higher heat deflection temperature when compared to CLR 1331 / CLH 5515 family. Machine dispense friendly with excellent thermal stability and thermal cycling performance. A heat cure, low stress, extremely tough, epoxy casting compound. Product was specifically designed for casting large bushings, insulators, instrument and power transformers. The cured material exhibits excellent thermal stability and thermal cycling characteristics. This product meets UL94-HB flammability requirements.
Heat Cure low-stress, extremely tough, epoxy casting system casting system for large bushings, insulators, power and instrument transformers. Higher heat deflection temperature when compared to CLR 1331 / CLH 5515 family. Machine dispense friendly with excellent thermal stability and thermal cycling performance. The cured material exhibits excellent thermal stability and thermal cycling characteristics. This product meets UL94-HB flammability requirements.
Heat Cure low-stress, extremely tough, epoxy casting system casting system for large bushings, insulators, power and instrument transformers. Higher heat deflection temperature when compared to CLR 1331 / CLH 5515 family. Machine dispense friendly with excellent thermal stability and thermal cycling performance. The cured material exhibits excellent thermal stability and thermal cycling characteristics. This product meets UL94-HB flammability requirements.
Heat Cure low-stress, extremely tough, epoxy casting system casting system for large bushings, insulators, power and instrument transformers. Higher heat deflection temperature when compared to CLR 1331 / CLH 5515 family. Machine dispense friendly with excellent thermal stability and thermal cycling performance. The cured material exhibits excellent thermal stability and thermal cycling characteristics. This product meets UL94-HB flammability requirements.
Product is recommended for potting and encapsulating applications. A two component, room temperature cure semi-flexible epoxy system. The system was developed for potting / casting of electrical and electronic components. Its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment.
