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A low viscosity, two component, unfilled, room temperature cure, epoxy system. This system provides resiliency and strength making it suitable for a variety of applications. ie. adhesives, castings, coatings and tooling. CLR 1180 / CLH 6020
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A two component, unfilled, room temperature cure epoxy, for coating, casting, and adhesive applications. CLR 1180 / CLH 6770
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Room temp cure, excellent shock resistance. An exceptional epoxy laminating system with excellent thermal and mechanical shock resistance. Product is suitable for a variety of applications. CLR 1180 / CLH 6930
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R.T. Cure. 105°C operating. Small coils & Transformers, Electronics, Resistant to fuels. A 100% solids epoxy which is recommended for potting and casting transformers, coils and other components. It cures quickly at low temperatures and is resistant to gasoline and other solvents. CLR 1190 / CLH 6020
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General purpose variable substrate adhesive. A medium viscosity, unfilled casting system. It is suitable for large mass castings and exhibits good impact resistance. CLR 1190 / CLH 6025
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General purpose variable substrate adhesive. A two component room temperature curing epoxy system. Product is suitable for potting, adhesive, and coating applications. Product meets the food and drug administration (FDA) regulations permitting use in food contact applications. CLR 1190 / CLH 6140
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Solvent resistant. Good Adhesive. A room temperature cure casting system with excellent chemical resistance. When properly post cured, the product is suited for operation at elevated temperatures. CLR 1190 / CLH 6372
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Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560
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130°C Operating. Low Exotherm, low shrinkage, excellent shock resistance. A two component epoxy which is recommended for potting and casting transformers, coils and other electronic components. The system provides a good pot life with low exotherm and shrinkage. Cured material has excellent thermal shock resistance. CLR 1376 / CLH 6930
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Low viscosity epoxy, Suitable for machine dispense, Pot / Cast electronic switches. A low viscosity, general purpose, room temperature curing, epoxy encapsulant. Product is filled with non-abrasive fillers suitable for machine dispensing. Product has good physical, thermal and electrical properties. CLR 1476 / CLH 6730
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Room Temperature Cure, filled epoxy system suitable for machine dispense. Developed for potting and casting of electrical and electronic components. The cured material exhibits excellent thermal cycling endurance. CLR 1556 / CLH 6640
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Excellent heat dissipation, 125°C Operating. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required. CLR 1566 / CLH 6020
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Long pot life, Excellent heat dissipation. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required. CLR 1566 / CLH 6025
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Product is machine dispense friendly. A filled, high temperature operating, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive fillers and convenient mix ratio makes it suitable for processing in automatic dispense equipment. As part of an insulating system, it will meet class H, electrical temperature. This product meets UL94-V1 in house flammability testing. CLR 1820 / CLH 6440
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UL 94-V1 Epoxy system for casting and potting electrical and electronic components, as part of an electrical insulating system it will meet Class H electrical temperature classification. A filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio makes it suitable for processing in automatic dispense equipment. CLR 1821 / CLH 6441
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1:1 Mix Ratio, Fast Gel, Medium viscosity, Flameout, 180°C operating, Ballast potting. A filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio make it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. CLR 1826 / CLH 6445
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A semi-flexible, 100% solid, epoxy system. This product was specifically developed for potting / casting of electrical and electronic components. The long pot life of the material makes it suitable for large mass castings or heat induced curing with minimal stress. Product passes UL94-HB in-house flammability testing. For a more rigid system, CLR 3517 / CLH 6230 is recommended. CLR 3507 / CLH 6230
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Room temperature cure, filled, semi-flexible epoxy system. Long pot life material is suitable for large mass casting or heat-induced curing with minimal stress. This product was specifically developed for potting / casting of electrical and electronic components. The long pot life of the material makes it suitable for large mass castings or heat induced curing with minimal stress. For a softer system, CLR 3506 / CLH 6230 is recommended. CLR 3516 / CLH 6230
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UL 94-V0 certified fast setting, potting / casting PU for transformers, coils, and electronic components. A two component, low viscosity, polyurethane casting system, specifically designed for casting transformers, coils and electronic components. Product has excellent thermal shock resistance. XP 61862 / CLI 4161
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High temperature clear epoxy. An unfilled, heat resistant, clear laminating system. Products low viscosity gives the system excellent wet-out properties to fibreglass and other reinforcing fibres. The material exhibits high physical strengths and modulus with moderate post cure temperatures. XRD 1014 / XHD 1015