1:1 Mix Ratio, Fast Gel, Medium viscosity, Flameout, 180°C operating, Ballast potting. A filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio make it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing.