Single component systems for dipping and impregnating various devices. Some are suitable for potting and adhesive applications.
| System | Description |
|---|---|
| CLS9420 | Structural Adhesive / This compound gels quickly at elevated temperatures with excellent adhesion to most substrates. |
| CLS9600 | Coil Impregnation / 220°C Operating, Bonds well, Reduces noise, 100% solids (no solvents), Suitable for Sand Casting. |
| CLS9611 | Ferrite Encapsulation. Low stress, Grey colour, UL 94HB, 155°C Operating. |
| CLS9616 | Ferrite Encapsulation. Low stress, UL 94HB, 155°C Operating. |