Superior protection provided by our proven electronic potting and encapsulating solutions
Your sensors and printed circuit boards (PCBs) are at risk from chemical and environmental damages. Today’s competitive marketplace demands reliability. So delicate components compromised because of high temperatures, cryogenic conditions, chemicals, rigorous thermal cycling, mechanical shock, thermal shock and other conditions can cause losses of time and money.
The right potting and encapsulating formulations provide protection from moisture and corrosive agents, stop dangerous arcing, resist shocks and vibrations, prevent excessive heat build up, and much more.
Contact Crosslink today and discover out how our electronic potting and encapsulating solutions can protect your sensors and bottom line.
Better Flexibility and Performance
Two-part epoxy compounds are most frequently used for potting and encapsulating sensors and PCBs. They offer unmatched versatility and range of applications.
They can:
- Adhere strongly to many different kinds of materials
- Provide protection from chemicals
- Have superior dielectric properties
- Be made thermally conductive and electrically insulative, though are usually thermally insulative
- Can withstand thermal cycling, stresses and shocks
- Provide protection from extremes of temperature
Although epoxies are usually rigid and used as a permanent solution, they can also be formulated to be more flexible, allowing, for example, easy retrieval of a component. They are also considered better protection for hazardous conditions than silicone compounds.
Formulated to Your Specific Needs
At Crosslink Technologies, we offer a variety of proven electronic potting and encapsulating solutions for sensors and PCBs. We can also create custom formulations designed to meet the specific needs of your manufacturing operation.
Contact Crosslink today and discover out how our electronic potting and encapsulating solutions can protect your sensors and bottom line.
