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A two component, room temperature cure patching and sealing compound. This product has excellent adhesion to plastics and various metals. CLC 16-228
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Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6330
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Large mass casting, 30-minute pot life. Masses larger than 6Lbs. A two component, filled, room temperature cure epoxy system.the product has a low exotherm and low shrinkage, making it suitable for castings larger than 3 kgs. CLR 1066 / CLH 6930
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A low viscosity, two component, unfilled, room temperature cure, epoxy system. This system provides resiliency and strength making it suitable for a variety of applications. ie. adhesives, castings, coatings and tooling. CLR 1180 / CLH 6020
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R.T. Cure. 105°C operating. Small coils & Transformers, Electronics, Resistant to fuels. A 100% solids epoxy which is recommended for potting and casting transformers, coils and other components. It cures quickly at low temperatures and is resistant to gasoline and other solvents. CLR 1190 / CLH 6020
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General purpose variable substrate adhesive. A medium viscosity, unfilled casting system. It is suitable for large mass castings and exhibits good impact resistance. CLR 1190 / CLH 6025
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General purpose variable substrate adhesive. A two component room temperature curing epoxy system. Product is suitable for potting, adhesive, and coating applications. Product meets the food and drug administration (FDA) regulations permitting use in food contact applications. CLR 1190 / CLH 6140
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Room Temperature Cure, Unfilled semi-flexible epoxy coating and casting systems with improved thermal and shock resistance. A low viscosity, clear coating epoxy, material features long pot life and good impact resistance. CLR 1190 / CLH 6230
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130°C Operating. Low Exotherm, low shrinkage, excellent shock resistance. A two component epoxy which is recommended for potting and casting transformers, coils and other electronic components. The system provides a good pot life with low exotherm and shrinkage. Cured material has excellent thermal shock resistance. CLR 1376 / CLH 6930
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Low Density, Flame Retardant, 120°C Operating. A two component, low density, room temperature curing, flame retardant, epoxy potting/casting compound. CLR 1415 / CLH 6220
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Low viscosity epoxy, Suitable for machine dispense, Pot / Cast electronic switches. A low viscosity, general purpose, room temperature curing, epoxy encapsulant. Product is filled with non-abrasive fillers suitable for machine dispensing. Product has good physical, thermal and electrical properties. CLR 1476 / CLH 6730
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Low viscosity, RT cure. Excellent thermal shock resistance. A low viscosity adhesive with excellent thermal and mechanical shock resistance. CLR 1510 / CLH 6580
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Excellent heat dissipation, 125°C Operating. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required. CLR 1566 / CLH 6020
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Long pot life, Excellent heat dissipation. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required. CLR 1566 / CLH 6025
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Excellent for potting thermostats and sensors. A two component, room temperature cure, potting and encapsulating epoxy system. Material contains non-abrasive fillers suitable for machine dispense. CLR 1583 / CLH 6229
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UL 94-V0 system for potting and casting small electronic parts that require thermal shock and thermal cycling performance. A two component, low viscosity, room temperature cure epoxy system. Material has yellow card UL94-V0 rating, and contains non abrasive fillers suitable for meter mix dispense. CLR 1796 / CLH 6580
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Product is machine dispense friendly. A filled, high temperature operating, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive fillers and convenient mix ratio makes it suitable for processing in automatic dispense equipment. As part of an insulating system, it will meet class H, electrical temperature. This product meets UL94-V1 in house flammability testing. CLR 1820 / CLH 6440
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UL 94-V1 Epoxy system for casting and potting electrical and electronic components, as part of an electrical insulating system it will meet Class H electrical temperature classification. A filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio makes it suitable for processing in automatic dispense equipment. CLR 1821 / CLH 6441
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1:1 Mix Ratio, Fast Gel, Medium viscosity, Flameout, 180°C operating, Ballast potting. A filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio make it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. CLR 1826 / CLH 6445
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Higher heat deflection temperature when compared to CLR 1331 / CLH 5515 family. Machine dispense friendly with excellent thermal stability and thermal cycling performance. A heat cure, low stress, extremely tough, epoxy casting compound. Product was specifically designed for casting large bushings, insulators, instrument and power transformers. The cured material exhibits excellent thermal stability and thermal cycling characteristics. This product meets UL94-HB flammability requirements. CLR 1831 / CLH 5185