CLR 1066 / CLH 6520

Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6520

CLR 1190 / CLH 6560

Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560

CLR 1205 / CLH 6770

Clear low viscosity semi-flexible adhesive / sealant. A low viscosity, two component unfilled, room temperature cure epoxy system. CLR 1205 / CLH 6770

CLR 1556 / CLH 6640

Room Temperature Cure, filled epoxy system suitable for machine dispense. Developed for potting and casting of electrical and electronic components. The cured material exhibits excellent thermal cycling endurance. CLR 1556 / CLH 6640

XRD 1575 / XH 61418

2:1 machine dispense adhesive. Bonding abrasive wheels and disks. A two component epoxy system suitable for potting, casting and adhesive applications. Product gels quickly and has good thermal cycling endurance. Material is filled with non-abrasive fillers making it suitable for machine dispensing. XRD 1575 / XH6 1418