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  1. CLP 7106 / CLI 4010

    Flexible polyurethane system for potting and casting in electrical applications. A two component, low viscosity, low durometer, polyurethane potting compound. The cured material meets the requirements of UL94-V0. CLP 7106 / CLI 4010

  2. CLP 7330 / CLI 4161

    Economical, flexible, potting and casting polyurethane system. a solventless, low viscosity, flexible, two component polyurethane casting resin. CLP 7330 / CLI 4161

  3. CLR 1020 / CLH 6021

    Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1020 / CLH 6021

  4. CLR 1026 / CLH 6021

    Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1026 / CLH 6021

  5. CLR 1066 / CLH 6330

    Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6330

  6. CLR 1066 / CLH 6520

    Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6520

  7. CLR 1066 / CLH 6930

    Large mass casting, 30-minute pot life. Masses larger than 6Lbs. A two component, filled, room temperature cure epoxy system.the product has a low exotherm and low shrinkage, making it suitable for castings larger than 3 kgs. CLR 1066 / CLH 6930

  8. CLR 1180 / CLH 6770

    A two component, unfilled, room temperature cure epoxy, for coating, casting, and adhesive applications. CLR 1180 / CLH 6770

  9. CLR 1180 / CLH 6930

    Room temp cure, excellent shock resistance. An exceptional epoxy laminating system with excellent thermal and mechanical shock resistance. Product is suitable for a variety of applications. CLR 1180 / CLH 6930

  10. CLR 1190 / CLH 6020

    R.T. Cure. 105°C operating. Small coils & Transformers, Electronics, Resistant to fuels. A 100% solids epoxy which is recommended for potting and casting transformers, coils and other components. It cures quickly at low temperatures and is resistant to gasoline and other solvents. CLR 1190 / CLH 6020

  11. CLR 1190 / CLH 6025

    General purpose variable substrate adhesive. A medium viscosity, unfilled casting system. It is suitable for large mass castings and exhibits good impact resistance. CLR 1190 / CLH 6025

  12. CLR 1190 / CLH 6140

    General purpose variable substrate adhesive. A two component room temperature curing epoxy system. Product is suitable for potting, adhesive, and coating applications. Product meets the food and drug administration (FDA) regulations permitting use in food contact applications. CLR 1190 / CLH 6140

  13. CLR 1190 / CLH 6560

    Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560

  14. CLR 1205 / CLH 6770

    Clear low viscosity semi-flexible adhesive / sealant. A low viscosity, two component unfilled, room temperature cure epoxy system. CLR 1205 / CLH 6770

  15. CLR 1370 / CLH 6560

    General purpose, shock resistant, Room temperature Cure. Excellent Tensile. An adhesive with excellent tensile shear and good peel strength after a 24 hour room temperature cure. Product exhibits excellent shock resistance in potting applications. CLR 1370 / CLH 6560

  16. CLR 1376 / CLH 6930

    130°C Operating. Low Exotherm, low shrinkage, excellent shock resistance. A two component epoxy which is recommended for potting and casting transformers, coils and other electronic components. The system provides a good pot life with low exotherm and shrinkage. Cured material has excellent thermal shock resistance. CLR 1376 / CLH 6930

  17. CLR 1415 / CLH 6220

    Low Density, Flame Retardant, 120°C Operating. A two component, low density, room temperature curing, flame retardant, epoxy potting/casting compound. CLR 1415 / CLH 6220

  18. CLR 1476 / CLH 6730

    Low viscosity epoxy, Suitable for machine dispense, Pot / Cast electronic switches. A low viscosity, general purpose, room temperature curing, epoxy encapsulant. Product is filled with non-abrasive fillers suitable for machine dispensing. Product has good physical, thermal and electrical properties. CLR 1476 / CLH 6730

  19. CLR 1556 / CLH 6510

    Good thermal cycling, 2:1 mix by volume. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance. CLR 1556 / CLH 6510

  20. CLR 1556 / CLH 6520

    Soft 50/40D, Slow gel - Electronic Modules, Machinable. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance. CLR 1556 / CLH 6520

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