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Product is recommended for potting and encapsulating applications. A two component, room temperature cure semi-flexible epoxy system. The system was developed for potting / casting of electrical and electronic components. Its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment. CLR 1946 / CLH 6500
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General Adhesive room temperature cure. Resistant to Toluene, Ethanol, Aviation Gas and Diesel Fuel. A low viscosity, two component, chemical resistant epoxy system. Post cured material has excellent resistance to most petroleum based fuels and solvents during exposure at ambient and elevated temperatures. CLR 3080 / CLH 6372
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Structural Adhesive. This compound gels quickly at elevated temperatures with excellent adhesion to most substrates. A single component structural adhesive. This compound gels quickly at elevated temperatures with excellent adhesion to most substrates. CLS 9420
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Density = 0.80. A low viscosity, low density, user-friendly, room temperature cure, MDI based polyurethane system. The product cures to a hardness of 60 shore A, and has a cured density of 0.80 gms/cm3. XPD 1401 / CLI 4182
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Excellent fuel resistance. Suitable for automotive fuel sensors. A two component, chemical resistant epoxy casting system. The cured product has improved thermal conductivity for applications where heat dissipation from thermally sensitive devices is required. Cured product is resistant to Ethanol, Gasoline, and Diesel, when exposed to these chemicals at ambient or elevated temperatures. XR 11483 / CLH 6260
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1:1 machine dispense adhesive. Adhesive for bonding synthetic aggregates to metal. A medium viscosity, room temperature curing, two component epoxy adhesive. Product was developed with improved thin film set time when bonding metal substrates. XR 52092 / XH 62093