CLS 9420

Structural Adhesive. This compound gels quickly at elevated temperatures with excellent adhesion to most substrates. A single component structural adhesive. This compound gels quickly at elevated temperatures with excellent adhesion to most substrates. CLS 9420

XR 11483 / CLH 6260

Excellent fuel resistance. Suitable for automotive fuel sensors. A two component, chemical resistant epoxy casting system. The cured product has improved thermal conductivity for applications where heat dissipation from thermally sensitive devices is required. Cured product is resistant to Ethanol, Gasoline, and Diesel, when exposed to these chemicals at ambient or elevated temperatures. XR 11483 / CLH 6260

XR 52092 / XH 62093

1:1 machine dispense adhesive. Adhesive for bonding synthetic aggregates to metal. A medium viscosity, room temperature curing, two component epoxy adhesive. Product was developed with improved thin film set time when bonding metal substrates. XR 52092 / XH 62093

XRD 1014 / XHD 1015

High temperature clear epoxy. An unfilled, heat resistant, clear laminating system. Products low viscosity gives the system excellent wet-out properties to fibreglass and other reinforcing fibres. The material exhibits high physical strengths and modulus with moderate post cure temperatures. XRD 1014 / XHD 1015

XRD 1116 / XHD 1117

Room Temperature Cure Epoxy system suitable for potting and casting electrical / electronic components. 2:1 machine dispense friendly mix. Suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. XRD 1116 / XHD 1117

XRD 1116 / XHD 1158

2:1 machine dispense friendly mix. A filled, room temperature cure, two component epoxy system. The product is suitable for potting / encapsulating electrical and electronic components. The use of non-abrasive fillers and the convenient mix ratio makes it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. XRD 1116 / XHD 1158

XRD 1116 / XHD 1281

Room temperature cure epoxy system suitable for potting and casting electrical / electronic components. 2:1 machine dispense friendly mix. The product is suitable for potting/encapsulating electrical and electronic components. The use of non-abrasive fillers and the convenient mix ratio makes it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. XRD 1116 / XHD 1281