1. CLR 1299 / XHD 1303

    General Purpose Aluminum. An aluminum filled, low viscosity, room temperature gelling, casting system. The product has excellent surface reproduction, and high strength. This system is recommended for use with aluminum shot for large mass casting. CLR 1299 / XHD 1303

  2. CLR 1321 / CLH 5100

    General Purpose Aluminum. An aluminum filled, low viscosity, room temperature gelling, casting system. The product has excellent surface reproduction, and high strength. This system is recommended for use with aluminum shot for large mass casting. CLR 1321 / CLH 5100

  3. CLR 1331 / CLH 5515

    Cured epoxy exhibits excellent thermal stability and thermal cycling performance. A two component, heat cured epoxy system, developed specifically for use on instrument and power transformers. The cured material exhibits excellent thermal stability and thermal cycling performance. Product meets UL94-HB flammability requirements. CLR 1331 / CLH 5515

  4. CLR 1336 / CLH 5515

    Heat Cure Epoxy System formulated for instrument and power transformers. Cured epoxy exhibits excellent thermal stability and thermal cycling performance. The cured material exhibits excellent thermal stability and thermal cycling performance. Product meets UL94-HB flammability requirements. CLR 1336 / CLH 5515

  5. CLR 1337 / CLH 5515

    Cured epoxy exhibits excellent thermal stability and thermal cycling performance. A two component, heat cured epoxy system, developed specifically for use on instrument and power transformers. The cured material exhibits excellent thermal stability and thermal cycling performance. Product meets UL94-HB flammability requirements. CLR 1337 / CLH 5515

  6. CLR 1370 / CLH 6560

    General purpose, shock resistant, Room temperature Cure. Excellent Tensile. An adhesive with excellent tensile shear and good peel strength after a 24 hour room temperature cure. Product exhibits excellent shock resistance in potting applications. CLR 1370 / CLH 6560

  7. CLR 1376 / CLH 6930

    130°C Operating. Low Exotherm, low shrinkage, excellent shock resistance. A two component epoxy which is recommended for potting and casting transformers, coils and other electronic components. The system provides a good pot life with low exotherm and shrinkage. Cured material has excellent thermal shock resistance. CLR 1376 / CLH 6930

  8. CLR 1396 / CLH 6930

    Extremely strong adhesive. Remains strong at elevated temperatures. A high performance, room temperature curing, 100% solids, epoxy adhesive. This product bonds to a wide variety of substrates and was specifically developed to seal porous metal substrates. CLR 1396 / CLH 6930

  9. CLR 1415 / CLH 6220

    Low Density, Flame Retardant, 120°C Operating. A two component, low density, room temperature curing, flame retardant, epoxy potting/casting compound. CLR 1415 / CLH 6220

  10. CLR 1476 / CLH 6730

    Low viscosity epoxy, Suitable for machine dispense, Pot / Cast electronic switches. A low viscosity, general purpose, room temperature curing, epoxy encapsulant. Product is filled with non-abrasive fillers suitable for machine dispensing. Product has good physical, thermal and electrical properties. CLR 1476 / CLH 6730

  11. CLR 1510 / CLH 6580

    Low viscosity, RT cure. Excellent thermal shock resistance. A low viscosity adhesive with excellent thermal and mechanical shock resistance. CLR 1510 / CLH 6580

  12. CLR 1566 / CLH 6020

    Excellent heat dissipation, 125°C Operating. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required. CLR 1566 / CLH 6020

  13. CLR 1566 / CLH 6025

    Long pot life, Excellent heat dissipation. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required. CLR 1566 / CLH 6025

  14. CLR 1583 / CLH 6229

    Excellent for potting thermostats and sensors. A two component, room temperature cure, potting and encapsulating epoxy system. Material contains non-abrasive fillers suitable for machine dispense. CLR 1583 / CLH 6229

  15. CLR 1625 / CLH 6330

    General Purpose Epoxy. An unfilled, room temperature cure, clear laminating system. Its low viscosity gives the system excellent wet -out properties to fibreglass and other reinforcing fibres. The material will also saturate wood readily. For a faster system use hardener CLH 6333. CLR 1625 / CLH 6330

  16. CLR 1625 / CLH 6333

    General Purpose Epoxy. An unfilled, room temperature cure, clear laminating system. Products low viscosity gives the system excellent wet-out properties to fibreglass and other reinforcing fibres. The material will also saturate wood readily. CLR 1625 / CLH 6333

  17. CLR 1730 / CLH 6372

    Heat and chemical/fuel resistant adhesive/laminating. A two component heat and chemical resistant epoxy laminating system. CLR 1730 / CLH 6372

  18. CLR 1796 / CLH 6580

    UL 94-V0 system for potting and casting small electronic parts that require thermal shock and thermal cycling performance. A two component, low viscosity, room temperature cure epoxy system. Material has yellow card UL94-V0 rating, and contains non abrasive fillers suitable for meter mix dispense. CLR 1796 / CLH 6580

  19. CLR 1820 / CLH 6440

    Product is machine dispense friendly. A filled, high temperature operating, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive fillers and convenient mix ratio makes it suitable for processing in automatic dispense equipment. As part of an insulating system, it will meet class H, electrical temperature. This product meets UL94-V1 in house flammability testing. CLR 1820 / CLH 6440

  20. CLR 1821 / CLH 6441

    UL 94-V1 Epoxy system for casting and potting electrical and electronic components, as part of an electrical insulating system it will meet Class H electrical temperature classification. A filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio makes it suitable for processing in automatic dispense equipment. CLR 1821 / CLH 6441

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