A low viscosity, aluminum filled, room temperature gelling casting system. Product has excellent surface reproduction and high strength. This system is recommended for use with aluminum shot for large mass casting. The product may be cast up to 2 inches in depth. CLR 1296 / XHD 1303
General Purpose Aluminum. An aluminum filled, low viscosity, room temperature gelling, casting system. The product has excellent surface reproduction, and high strength. This system is recommended for use with aluminum shot for large mass casting. CLR 1299 / CLH 6330
General Purpose Aluminum. An aluminum filled, low viscosity, room temperature gelling, casting system. The product has excellent surface reproduction, and high strength. This system is recommended for use with aluminum shot for large mass casting. CLR 1299 / XHD 1303
General purpose, shock resistant, Room temperature Cure. Excellent Tensile. An adhesive with excellent tensile shear and good peel strength after a 24 hour room temperature cure. Product exhibits excellent shock resistance in potting applications. CLR 1370 / CLH 6560
Extremely strong adhesive. Remains strong at elevated temperatures. A high performance, room temperature curing, 100% solids, epoxy adhesive. This product bonds to a wide variety of substrates and was specifically developed to seal porous metal substrates. CLR 1396 / CLH 6930
Low Density, Flame Retardant, 120°C Operating. A two component, low density, room temperature curing, flame retardant, epoxy potting/casting compound. CLR 1415 / CLH 6220
Low viscosity, RT cure. Excellent thermal shock resistance. A low viscosity adhesive with excellent thermal and mechanical shock resistance. CLR 1510 / CLH 6580
Abrasion Resistant Epoxy. An abrasion resistant, two component epoxy surface coat. CLR 1710 / CLH 6710
Heat and chemical/fuel resistant adhesive/laminating. A two component heat and chemical resistant epoxy laminating system. CLR 1730 / CLH 6372
UL 94-V0 system for potting and casting small electronic parts that require thermal shock and thermal cycling performance. A two component, low viscosity, room temperature cure epoxy system. Material has yellow card UL94-V0 rating, and contains non abrasive fillers suitable for meter mix dispense. CLR 1796 / CLH 6580
Product is recommended for potting and encapsulating applications. A two component, room temperature cure semi-flexible epoxy system. The system was developed for potting / casting of electrical and electronic components. Its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment. CLR 1946 / CLH 6500
General Adhesive room temperature cure. Resistant to Toluene, Ethanol, Aviation Gas and Diesel Fuel. A low viscosity, two component, chemical resistant epoxy system. Post cured material has excellent resistance to most petroleum based fuels and solvents during exposure at ambient and elevated temperatures. CLR 3080 / CLH 6372
Structural Adhesive. This compound gels quickly at elevated temperatures with excellent adhesion to most substrates. A single component structural adhesive. This compound gels quickly at elevated temperatures with excellent adhesion to most substrates. CLS 9420
High Temperature. A single component, 100% solids, low viscosity, impregnating compound for coils and transformers. This product is also suitable for sand casting. CLS 9600
A low viscosity, single component, epoxy potting and encapsulating compound. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL 94-HB flammability requirements. Heat Cure Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. CLS 9611
Heat Cure. Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. Low viscosity. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL94-HB flammability requirements. CLS 9616
Density = 0.80. A low viscosity, low density, user-friendly, room temperature cure, MDI based polyurethane system. The product cures to a hardness of 60 shore A, and has a cured density of 0.80 gms/cm3. XPD 1401 / CLI 4182
Excellent fuel resistance. Suitable for automotive fuel sensors. A two component, chemical resistant epoxy casting system. The cured product has improved thermal conductivity for applications where heat dissipation from thermally sensitive devices is required. Cured product is resistant to Ethanol, Gasoline, and Diesel, when exposed to these chemicals at ambient or elevated temperatures. XR 11483 / CLH 6260
1:1 machine dispense adhesive. Adhesive for bonding synthetic aggregates to metal. A medium viscosity, room temperature curing, two component epoxy adhesive. Product was developed with improved thin film set time when bonding metal substrates. XR 52092 / XH 62093
High temperature clear epoxy. An unfilled, heat resistant, clear laminating system. Products low viscosity gives the system excellent wet-out properties to fibreglass and other reinforcing fibres. The material exhibits high physical strengths and modulus with moderate post cure temperatures. XRD 1014 / XHD 1015